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Prime & Bond® NT™ Nano-Technology Light Cured Dental Adhesive

Vendor:  DENTSPLY Caulk
Prime & Bond® NT™ Total Etch Adhesive is based on 16+ years of trusted, clinically proved PENTA (dipentaerythritol penta acrylate monophosphate) resin technology and can be used in virtually all restorative bonding procedures. Exclusive nanofillers ensure marginal integrity and exhibit deep penetration into tubules and horizontal interconnects.
 Product Details 
Specifications:

  • Proven long-term results
  • Low film thickness
  • High bond strength values to enamel and dentin
  • Simple to use one-bottle system
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