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Product Profile

XP Bond™ Universal Total Etch Adhesive

Vendor: DENTSPLY Caulk

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XP Bond® Total Etch Adhesive has wide wet-to-dry prep tolerance making Dentsply's most forgiving bonding agent. XP Bond offers substantially smaller nano-filler particles meaning a more densely packed bonding matrix. Usable as a light cure, self cure and cual cure adhesive.

Product Details

Specifications:

Wide wet-to-dry prep tolerance
Tertiary-Butanol solvent improves handling
Self-cure for PFM and endo canal applications
Simple to use one-bottle system

Specialties:

General Dentistry
Pediatric Dentistry
Prosthodontics

Product Category:

Bonding Agents